RecordNumber

18476

Title

Flip chip technologies

Author Statement

John H. Lau editor

Publication

McGraw-Hill

Publication Year

1996

Collation

xxiv, 565P

Series

Electronic packaging and interconnection series

Notes

0070366098 , Includes bibliographical references

Subject

Multichip modules (Microelectronics) , Microelectronic Packaging

ADDED ENTRIES

Lau, John H. ,

LC Class

TK

LC Number

7874

LC CutterNumber

.F58

LC Date

1995