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RecordNumber
18476
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Title
Flip chip technologies
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Author Statement
John H. Lau editor
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Publication
McGraw-Hill
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Publication Year
1996
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Collation
xxiv, 565P
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Series
Electronic packaging and interconnection series
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Notes
0070366098 , Includes bibliographical references
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Subject
Multichip modules (Microelectronics) , Microelectronic Packaging
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ADDED ENTRIES
Lau, John H. ,
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LC Class
TK
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LC Number
7874
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LC CutterNumber
.F58
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LC Date
1995
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Link To Document :
