RecordNumber
41056
Author
Madenci, Erdogan
Title
Fatigue life prediction of solder joints in electronic packages with ANSYS
Author Statement
by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.
Publication
Kluwer Academic Publishers
Publication Year
2003
Collation
xx, 185 p. : ill. ; 25 cm
Series
Kluwer international series in engineering and computer science ; SECS 719
Notes
1402073305 (alk. paper) , Includes bibliographical references and index
Subject
Electronic packaging , Solder and soldering , Metals , Service life (Engineering) , ANSYS (Computer system)
ADDED ENTRIES
Guven, Ibrahim. , Kilic, Bahattin
LC Class
TK
LC Number
7870.15
LC CutterNumber
.M32
LC Date
2002
وارد کنندة اطلاعات
JALALIFAR
تاريخ ورود اطلاعات
31/2/1390