چكيده به لاتين
Aluminum (Al), due to its unique properties, is one of the important metals. Aluminum and its alloys are broadly used in various applications such as automobile, aircraft, army, high technologies and so on. Which require bonding among Al, it's alloys and other metals. One of these bonding methods is diffusional bonding. Due to high usage of Al alloys, group 6xxx, their bondings, proper filler metal and the optimal conditions for a desirable bonding are very important.
In the present work, Si diffusion from Al-12Si into Al 6063 alloy through the diffusional bonding method of TLP is kinetically and thermodynamically studied. Our goals is to determine optimal parameters for a desirable bonding which will be achieved by studying the kinetic and thermodynamic behaviors of the elements here is Si which behavior characterization plays an essential role to achieve our goal. In this research, Al-6063 and Al-4047 are used as base metal and filler metal, respectively.
The TLP treatment was done through the oven bonding and at T=585 oC. The samples were subjected to the pressure of 70 psi using some fixtures and were kept in the oven for 10 to 60 minutes. Then, the samples were studied using optic and electron microscope. Micro hardness test, XRD and the Simultaneous Thermal Analysis (STA) were also performed on the samples. Next, kinetic and thermodynamic analysis in terms of microstructural studies, micro hardness test and calorimetry were done.
Amongst, structural changes in the filler metal and the base metal, the element's diffusion and corresponding concentration variations, diffusion coefficients and velocity, phone transformations in different regions, micro hardness variations, enthalpy variation and it's effect are analysed. Finally optimal conditions for a desirable bonding based on kinetic and thermodynamic parameters were suggested.
Key words: Aluminum, silicon, kinetic and thermodynamic, diffusion bonding, TLP, base metal, filler metal
