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RecordNumber
41056
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Author
Madenci, Erdogan
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Title
Fatigue life prediction of solder joints in electronic packages with ANSYS
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Author Statement
by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic.
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Publication
Kluwer Academic Publishers
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Publication Year
2003
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Collation
xx, 185 p. : ill. ; 25 cm
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Series
Kluwer international series in engineering and computer science ; SECS 719
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Notes
1402073305 (alk. paper) , Includes bibliographical references and index
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Subject
Electronic packaging , Solder and soldering , Metals , Service life (Engineering) , ANSYS (Computer system)
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ADDED ENTRIES
Guven, Ibrahim. , Kilic, Bahattin
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LC Class
TK
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LC Number
7870.15
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LC CutterNumber
.M32
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LC Date
2002
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وارد کنندة اطلاعات
JALALIFAR
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تاريخ ورود اطلاعات
31/2/1390
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Link To Document :
