RecordNumber
42880
Author
International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (4th : 2000 : Espoo, Finland)
Title
4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing
SubTitle
proceedings presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000
Author Statement
proceedings editor, Marika Hyyti�ainen Forth International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing
Publication
IEEE
Publication Year
2000
Collation
xii, 319 p.: ill
Notes
Sponsored by, NOKIA ... , Includes bibliographical references and index , 0780364600
Subject
Electronic packaging , Adhesive joints , Coating processes , Multichip modules (Microelectronics)
ADDED ENTRIES
AU Hyytiainen, Marika , CO Nokia (Firm) , TI
LC Class
TK
LC Number
7870.15
LC CutterNumber
.I568
LC Date
2000