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RecordNumber
42880
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Author
International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing (4th : 2000 : Espoo, Finland)
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Title
4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing
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SubTitle
proceedings presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000
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Author Statement
proceedings editor, Marika Hyyti�ainen Forth International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing
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Publication
IEEE
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Publication Year
2000
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Collation
xii, 319 p.: ill
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Notes
Sponsored by, NOKIA ... , Includes bibliographical references and index , 0780364600
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Subject
Electronic packaging , Adhesive joints , Coating processes , Multichip modules (Microelectronics)
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ADDED ENTRIES
AU Hyytiainen, Marika , CO Nokia (Firm) , TI
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LC Class
TK
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LC Number
7870.15
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LC CutterNumber
.I568
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LC Date
2000
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Link To Document :
